| abstract |
Integrated multilayer structure (100), comprising a substrate film (102) having a first side (102A) and an opposite second side (102B), said substrate film comprising electrically substantially insulating material, a circuit design comprising a number of electrically conductive areas (106) of electrically conductive material on said first and/or second sides of the substrate film, a connector (110) comprising a number of electrically conductive contact elements (118), said connector being provided to the substrate film so that it extends to both said first and second sides of said substrate film and said number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element (112) responsive to mating the external connecting element with the connector on said first or second side of or adjacent to the substrate film, and at least one plastic layer (104, 105), preferably of thermoplastic material, molded onto said first and/or second side of the substrate film so as to at least partially cover the connector and enhance securing of the connector to the substrate film. Corresponding method of manufacture is presented. |