Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02323 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-0453 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-0486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-60 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
filingDate |
2019-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_841d6ecf5f3adb33e27c882456f39ce1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d04be56a9d142d17374c31321a508079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23b76f11eb5d512ca88962d4037a1290 |
publicationDate |
2019-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2019164636-A1 |
titleOfInvention |
Method for processing a mask substrate to enable better film quality |
abstract |
The present disclosure provides methods for forming a material layer in a film stack for manufacturing a photomask in EUV applications and phase shift and binary photomask applications. In one example, a method for forming a dielectric material on a substrate includes supplying an oxygen containing gas mixture on a substrate in a processing chamber, the substrate comprising a dielectric material disposed on an optically transparent silicon containing material, maintaining the oxygen containing gas mixture in the processing chamber at a process pressure at greater than 2 bar, and thermally treating the dielectric material in the presence of the oxygen containing gas mixture. |
priorityDate |
2018-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |