Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G2-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-224 |
filingDate |
2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c671432cd8ac8b3a90bcbabcce86830f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57003384f6b234c192e0cc572ca914ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_333780a2cce0e602cfecad13eb84d49b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25a693580d0671ec10fb4673c6783ee9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06df83069ce51c2949a8534320966055 |
publicationDate |
2019-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2019163292-A1 |
titleOfInvention |
Resin composition for multilayer electronic components, dry film, cured product, multilayer electronic component, and printed wiring board |
abstract |
Provided are: a resin composition for multilayer electronic components, which is suitable for the production of a small multilayer electronic component that exhibits excellent distinguishability in appearance inspection; a dry film which has a resin layer that is obtained from the composition; a cured product of the composition or the resin layer of the dry film; a multilayer electronic component which is provided with a protective layer that contains the cured product; and a printed wiring board which comprises the multilayer electronic component. A resin composition for multilayer electronic components, which is used for protective layers of a multilayer electronic component that is obtained by alternately stacking electrode layers and insulating layers and by providing protective layers on both end faces in the stacking direction, and which is characterized by containing a curable resin, an inorganic filler and a coloring agent. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022202427-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112635155-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021061339-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020170172-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021061340-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021110959-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112635155-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11610728-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021104357-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021104345-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7211322-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7211323-B2 |
priorityDate |
2018-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |