Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d751d5579f735abfee572dff3ae343c |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-673 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
filingDate |
2018-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1022a560a2055aab061f0aaacf692a7f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b223732e9371f789903708a475857c7f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17ff9542cc31325299b11459f9fe48b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca929b5b34b15f4fc33e88a7651b3138 |
publicationDate |
2019-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2019160570-A1 |
titleOfInvention |
System and method of fabricating tim-less hermetic flat top his/emi shield package |
abstract |
Disclosed is a semiconductor device and method of manufacturing a semiconductor device that includes planarizing surfaces of a semiconductor substrate and a carrier substrate and then placing the semiconductor substrate on the carrier substrate such that the planarized surfaces of each are adjoining and allowing the semiconductor substrate to bond to the carrier substrate using a Van der Waals force. The method also includes forming a metal filled trench around the semiconductor substrate and in contact with the carrier substrate, which can also be formed of metal. The metal filled trench and carrier substrate together form a metal cage-like structure around the semiconductor substrate that can serve as a heat sink, integrated heat spreader, and Electro- Magnetic Interference shield for the semiconductor substrate. |
priorityDate |
2018-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |