| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48de1cfdc993735cdc1c82f96827b33e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0014 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2019-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e9a0ea20d0337676142fd18e2aa579f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b0c731d7610c9b262447a0379dbfda7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18fc855ec9a4241ca1ea9e6281fa6a5c |
| publicationDate |
2019-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019160417-A1 |
| titleOfInvention |
Thermoforming an electronic device with surface curvature |
| abstract |
A method of manufacturing a curved electronic device (100) and resulting product. A patterned layer of non-conductive support material (12m) is printed onto a thermoplastic substrate (11) to form a support pattern. An electrical circuit (13,14) is applied onto the support pattern (12), wherein the electrical circuit (13,14) comprises circuit lines (13) comprising a conductive material (13m) applied onto support lines (12b) of the pattern and electrical components (14) applied onto support islands (12a) of the pattern. A thermoforming process (P) is used for deforming (S) the substrate (11) while a relatively high resistance of the support material (12m) to the deforming maintains a structural integrity of the electrical circuit (13,14). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021116532-A1 |
| priorityDate |
2018-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |