| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e16d1b3130c75f905199bb431589879 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-14865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-14532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-4115 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-18 |
| filingDate |
2019-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7aa28360de17618b89056f05fbf39569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6b71766b928bc6b4539e86144596eff |
| publicationDate |
2019-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019157106-A2 |
| titleOfInvention |
Methods for controlling physical vapor deposition metal film adhesion to substrates and surfaces |
| abstract |
A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate. |
| priorityDate |
2018-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |