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filingDate 2018-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2019152026-A1
titleOfInvention Asymmetrical device terminals for 3d interconnection of a stacked device
abstract A terminal interconnect of a device is positioned asymmetrically relative to one or more semiconductor bodies of the device. A difference between a footprint of the terminal interconnect and footprint of a semiconductor body is predominantly to one side of the terminal. The terminal interconnect portion adjacent to a side of the device structure may extend to a greater depth without exceeding a threshold aspect ratio. In some examples, a terminal interconnect coupled to a gate, source, or drain terminal of a finFET in a vertically-stacked device is positioned asymmetrically to a semiconductor fin. A portion of the terminal interconnect adjacent to the fin may extend to a depth below a plane of the fin and intersect another interconnect, or another device terminal, that is in another plane of the stacked device.
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