http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019151001-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2019-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd95339f6533a61c8e7f94acde46b4a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9545efccb44a548b9b6194cde627ba1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5117df5323734ea44e6f5d31d94aca51 |
| publicationDate | 2019-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2019151001-A1 |
| titleOfInvention | Method for processing substrate, method for manufacturing semiconductor device, and substrate-processing kit |
| abstract | The present invention provides a method for processing a substrate, wherein a transition metal-containing substance on the substrate can be highly efficiently removed while suppressing the retention of cerium on the surface of the processed substrate. The present invention also provides: a method for manufacturing a semiconductor device, the method comprising said method for processing a substrate; and a substrate-processing kit applicable to said method for processing a substrate. This method for processing a substrate comprises: step A in which a chemical solution containing a cerium compound and at least one pH adjusting agent selected from the group consisting of nitric acid, perchloric acid, ammonia, and sulfuric acid is used on a substrate having a transition metal-containing substance to remove the transition metal-containing substance; and step B in which at least one rinse solution selected from the group consisting of hydrogen peroxide-containing solutions as well as hydrogen peroxide-free acidic aqueous solutions other than hydrofluoric acid, nitric acid, perchloric acid aqueous solutions, oxalic acid aqueous solutions, and mixed aqueous solutions thereof is used to rinse the substrate obtained in step A. |
| priorityDate | 2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.