| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2019-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14017020d9f1ca816aa5ceb818558442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc3091c084c37b727948361d729c13c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcfca4e9b08c14c42cac0617538c6cbc |
| publicationDate |
2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019148107-A1 |
| titleOfInvention |
Systems and methods for copper (i) suppression in electrochemical deposition |
| abstract |
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operation and a second bath configured to maintain an anolyte during operation. The electroplating systems may include a catholyte tank and an anolyte tank fluidly coupled with the two baths of the two-bath electroplating chamber. The electroplating systems may include a first pump configured to provide catholyte from the catholyte tank to the first bath. The electroplating systems may include a second pump configured to provide anolyte from the anolyte tank to the second bath. The electroplating systems may also include an oxygen-delivery apparatus configured to provide an oxygen-containing fluid within the electroplating system. |
| priorityDate |
2018-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |