abstract |
The problem addressed by the present invention is to provide a resin composition for sealing capable of suppressing warpage even when sealing a large-area substrate. To solve this problem, a resin composition for sealing electronic components that contains (A) an epoxy resin, (B) a compound having a polyalkylene glycol chain, and (C) an inorganic filler is provided. The effect of being able to suppress warpage even when sealing a large-area substrate is obtained thereby. |