| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a226364af8a0915073444b8208024e2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_590e5c62baec5ecc0fb24585c4cec41a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2103-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V23-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V19-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V9-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-232 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K9-232 |
| filingDate |
2019-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59759b3a31b8e7250857be1d459f0993 |
| publicationDate |
2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019141155-A1 |
| titleOfInvention |
Method of making led light bulb with thermal radiation filaments |
| abstract |
A method of making a LED light bulb (50) with thermal radiation filaments (40) contains steps of: A. providing a substrate (10) which includes multiple conductive portions (12) formed on two ends of the substrate (10) respectively so as to electrically connect with an electronic circuit; B. molding LED chips (21), wires (23), and phosphors (22) on a front face of the substrate (10) so as to produce a LED filament sheet (20); C. forming a thermal radiation dissipation film (30) on a back face (11) of the substrate (10) before or after producing the LED filament sheet (20); D. cutting the substrate (10) into the thermal radiation filaments (40), wherein each of the thermal radiation filaments (40) has a part of the thermal radiation dissipation film (30), a part of the LED filament sheet (20), and parts of the multiple conductive portions (12) respectively; and E. fixing the thermal radiation filaments (40) into the LED light bulb (50). |
| priorityDate |
2018-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |