http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019132908-A1

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filingDate 2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1efea21c9bdb9a05b12439f5cbfa4a5b
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publicationDate 2019-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2019132908-A1
titleOfInvention Polygon shaped crystalline material for iii-v transistors
abstract Embodiments herein describe techniques for a semiconductor device including a substrate. A channel base including a layer of GaN may be above the substrate. A channel stack may be above the channel base, where the channel stack may include a layer of GaN in the channel stack and a polarization layer above the layer of GaN in the channel stack. A polygon shaped crystalline material may cover a sidewall of the channel stack including the polarization layer and the layer of GaN in the channel stack. The polygon shaped crystalline material may include n-type doped GaN. Furthermore, an n-type doped InGaN area may be around the polygon shaped crystalline material and above the channel base. A source contact may be above the n-type doped InGaN area and in contact with the n-type doped InGaN area. Other embodiments may be described and/or claimed.
priorityDate 2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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