| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2018-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2528c294a197de9b1219ff80e0c55e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5418d3424370a730c36a102aa328c155 |
| publicationDate |
2019-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019131413-A1 |
| titleOfInvention |
Thermosetting composition, thermosetting resin modifying agent, cured product of same, semiconductor sealing material, prepreg, circuit board and buildup film |
| abstract |
The present invention addresses the problem of providing: a thermosetting composition which enables a cured product thereof to achieve good copper foil adhesion, elastic modulus, heat resistance and toughness in a balanced manner; a thermosetting resin modifying agent; a cured product thereof; a semiconductor sealing material; a prepreg; a circuit board; and a buildup film. The present invention uses a thermosetting composition which contains a thermosetting resin, a thermal curing agent and a modified resin, and which is characterized in that: the modified resin is a thermoplastic resin that has at least one group selected from the group consisting of a hydroxyl group and a carboxy group; the modified resin has a glass transition temperature of from -100°C to 50°C (inclusive); and the modified resin has a number average molecular weight of from 600 to 50,000 (inclusive). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021006163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7337462-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230057954-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2021006163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210147945-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210056929-A |
| priorityDate |
2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |