| abstract |
The present invention addresses the problem of providing a primer composition which can quickly form a primer coating film which has excellent adhesion to a metal base material, adhesion to a top coating film containing a polyamide resin, and corrosion resistance. This primer composition that solves the problem is characterized by comprising a phenolic resin (A), a polyamide resin (B), and a solvent (C), wherein the phenolic resin (A) is a resole phenolic resin, the polyamide resin (B) is soluble in the solvent (C), and the solid content mass ratio (A/B) of the phenolic resin (A) to the polyamide resin (B) is 80/20 to 99/1. |