| abstract |
One aspect of the present disclosure proposes a method of fabricating quantum circuit assemblies that include Josephson Junctions. The method is based on providing an opening in a stack that includes an upper layer of a substrate, a layer of a first conductive material thereon, and a support layer over the conductive layer. The method further includes depositing a liner of a tunnel barrier material within the opening and providing a layer of a second conductive material within at least a portion of the opening lined with the liner. In this way, a Josephson Junction is formed, where the first conductive material forms the first electrode, the second conductive material forms the second electrode, and a portion of the liner forms the tunnel barrier. Such a method may be efficiently used in large-scale manufacturing and may result in Josephson Junctions having an improved performance compared to Josephson Junctions fabricated using existing techniques. |