| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2018-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cde6e9ca82e87e83de8a19b85c7de86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f62fb22a0786a2da5b97e9effdfc1192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28bf8b6ca0c0e1d07642332d55ce4826 |
| publicationDate |
2019-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019116927-A1 |
| titleOfInvention |
Copper foil with insulating resin layer |
| abstract |
The purpose of the present invention is to provide a copper foil with an insulating resin layer, which is suitable for use in a substrate for semiconductor element mounting and a thin printed wiring board that is provided with high-density fine wiring lines. A copper foil with an insulating resin layer according to the present invention comprises a copper foil and an insulating resin layer that is superposed on the copper foil. The arithmetic mean roughness (Ra) of a surface of the copper foil, said surface being in contact with the insulating resin layer, is 0.05-2 μm; and the insulating resin layer is formed from a resin composition that contains (A) a thermosetting resin , (B) a spherical filler and (C) glass short fibers that have an average fiber length of 10-300 μm. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110493962-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021166847-A1 |
| priorityDate |
2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |