| abstract |
A photocurable composition, comprising a photosensitive resin, a laser direct structuring additive, and a dispersing agent. The composition may be used in stereolithography (SLA) or in digital light processing (DLP) 3D printing and laser direct structuring methods to fabricate molded interconnecting devices that are used in a variety of applications, such as personal computers, laptops and portable computers, cell phone antennas and other communications devices of such type, medical applications, radio-frequency identification (RFID) applications, and automotive applications. |