| abstract |
Provided are: a flux which imparts thixotropy, and which exhibits excellent printing properties, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux.nThis flux includes a thixotropic agent, a rosin, an organic acid, and a solvent. The thixotropic agent comprises: a cyclic amide compound obtained by polycondensing a dicarboxylic acid and/or a tricarboxylic acid, and a diamine and/or a triamine into a cyclic shape; and an acyclic amide compound which is obtained by polycondensing a monocarboxylic acid, a dicarboxylic acid and/or a tricarboxylic acid into an acyclic shape. In the cyclic amide compound, the carbon numbers of the dicarboxylic acid and the tricarboxylic acid are in the range of 3 to 10 inclusive, and the carbon numbers of the diamine and the triamine are in the range of 2-54 inclusive. The flux includes at least 0.1 wt% but not more than 8.0 wt% of the cyclic amide compound, and at least 0.5 wt% but not more than 8.0 wt% of the acyclic amide compound. The total amount of the cyclic amide compound and the acyclic amide compound is at least 1.5 wt% but not more than 10.0 wt%. |