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filingDate 2018-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d6832d27f3e5f28bace3fccdfe3d75b
publicationDate 2019-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2019099754-A1
titleOfInvention System and method for improved electronic component interconnections
abstract Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111586979-A
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type http://data.epo.org/linked-data/def/patent/Publication

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