http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019097819-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-214 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 |
| filingDate | 2018-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334f81717612b72a029585c5e5a9896e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe2f71af3de340e4d78611fdc97a755d |
| publicationDate | 2019-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2019097819-A1 |
| titleOfInvention | Semiconductor process sheet and method for manufacturing semiconductor package |
| abstract | This semiconductor process sheet is provided with a double-sided adhesive sheet (10) and a partial sealing agent layer (20). The double-sided adhesive sheet (10) includes, in a laminated structure between adhesive surfaces (10a, 10b) thereof, a base material (11), a reduced adhesiveness-type adhesive agent layer (12), and, for example, a pressure-sensitive adhesive agent layer (13). The partial sealing agent layer (20) is positioned on the adhesive surface (10b) of the double-sided adhesive sheet (10). This method includes, for example: a step for mounting a plurality of semiconductor chips on the partial sealing agent layer (20) of the semiconductor process sheet having the adhesive surface (10a) adhered to a supporting body; a step for forming a sealing member section by curing the partial sealing agent layer (20) and a sealing agent, which is supplied so as to embed the semiconductor chips; a step for separating the sealing member section and the adhesive surface (10b); a step for forming a wiring structure part on the sealing member section; and a step for dividing the sealing member section and the wiring structure part for each of the semiconductor chips. This semiconductor process sheet and this method are suitable for efficiently manufacturing a semiconductor packages. |
| priorityDate | 2017-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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