http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019091208-A1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N33-543
filingDate 2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72ff103b83449319f98c4306a14f1f78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cd6012e66324ac218ae5994546c65eb
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publicationDate 2019-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2019091208-A1
titleOfInvention Surface chemical modification method, chip preparation method, and chip
abstract The present application provides a chemical modification method for a solid-phase substrate, a chip preparation method, and a chip. The chemical modification method for a solid-phase substrate in the present application comprises: carrying out surface modification on a solid-phase substrate, the surface modification comprising treatment of the surface of the solid-phase substrate by using a mixture, and the mixture comprising epoxy groups and hydrophilic group tail ends whose molar ratio is 1:1 to 1:1000. In the method in the present application, by controlling the molar ratio of the epoxy groups to the hydrophilic groups, the density of the epoxy groups and the hydrophilic groups on the surface can be conveniently regulated according to actual requirements, so that the number of loaded probes can be controlled. In addition, by introducing the hydrophilic groups on the surface, the hydrophobicity of the surface can be adjusted, the non-specific adsorption of the surface of the chip can be reduced, and performance of the chip can be improved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021224887-A1
priorityDate 2017-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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