| abstract |
The present invention relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth) acrylate; c) at least one catalyst; and d) at least one solvent, as well as associated methods and associated products. The compositions can form a dielectric film that produces substantially no debris when a pattern is formed on the dielectric film by a laser ablation method. |