| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_716ced455c5edbe3e93066825dc8d4ef |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76837
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2018-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56b0d203b217ba66a852da5b40cbb5ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3930f7c534b30091d5fb4986357dcb04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc85376a5946245a4a1bdf1ae9c9551e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f16ec2f6042a3a9891a5d96b88add8be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf2bed0c890b5bcc453774a7c67c3071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_598d9e1ca6260b428105d498924def0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_107d4e90620aff79ba3dcb0a2d6bd679 |
| publicationDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019046399-A1 |
| titleOfInvention |
METHODS FOR PRODUCING SELF-ALIGNED INTERCONNECTION HOLES |
| abstract |
Methods and apparatus for forming fully self-aligned vias. A first metal film is formed in the first recessed conductive lines and on the first insulating layer of a substrate comprising alternating conductive lines and a first insulating layer. Pillars and a sheet are formed from the first metal film. Some of the pillars and a portion of the sheet are selectively removed and a second insulating layer is deposited around the remaining pillars and the sheet. The remaining pillars and the sheet are removed to form vias and a trench in the second insulating layer. A third insulating layer is deposited in the vias and the trench and a cover is formed on the second insulating layer. Parts of the cover are selectively etched from the second insulating layer to expose the second insulating layer and the vias filled and leaving portions of the third insulating layer on the second insulating layer. The third insulating layer is selectively etched from some of the filled vias to form interconnect openings to the first conductive line and a trench. |
| priorityDate |
2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |