abstract |
The present invention relates to metal interconnects which may comprise a cobalt alloy, a nickel alloy or nickel. The invention also relates to methods for producing metal interconnections. The metal interconnects may comprise a barrier and / or adhesion layer, a seed layer, a filler material, a cap, or a combination thereof, and at least one of the barrier layer and / or or adhesion, the seed layer, the filler material, or the cap may comprise a cobalt alloy, a nickel alloy, nickel or a combination thereof. |