| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4b46493e28c7c8243f074c9d6c52949b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M2004-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-667
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M4-66 |
| filingDate |
2018-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a911addb84b15d80fc99edd5519384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c978345016365b2e6a6f44987657ccf1 |
| publicationDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019045374-A2 |
| titleOfInvention |
ELECTROLYTIC COPPER SHEET, PROCESS FOR PRODUCING SAME, AND NEGATIVE ELECTRODE OF HIGH CAPACITY LI-LIKE SECONDARY BATTERY INCLUDING THE SAME |
| abstract |
The present invention relates to an electrolytic copper foil current collector having high adhesion to an anode material by controlling the surface characteristics of the surface of the copper foil. The present invention provides an electrolytic copper foil having a first surface and a second surface, the electrolytic copper foil comprising: a first protective layer on the first surface side; A second protective layer on the second surface side; And a copper film between the first and second protective layers, wherein a coupling coefficient at the first surface or the second surface of the electrolytic copper foil is Rp / 탆 + peak density / 30 + Cr deposition amount / (mg / m 2 ) Wherein the peak density is a value measured according to the ASME B46.1 standard), wherein the coupling coefficient is 1.5 to 9.4. According to the present invention, it is possible to provide an electrolytic copper foil having a high adhesion with the negative electrode material and having a low electrical resistance by controlling the surface characteristics of the surface of the copper foil. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3913115-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I751024-B |
| priorityDate |
2017-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |