| abstract |
The invention relates to: a photosensitive resin composition that provides a cured body whose dielectric constant and dielectric loss tangent are further decreased; a method which employs said photosensitive resin composition to produce a cured relief pattern; and a semiconductor device which is provided with this hardened relief pattern. A negative photoresist composition which contains 100 parts by weight of (A), a polyimide precursor which has a specific unitary structure, and 0.1 to 20 parts by weight of (B), a photopolymerization initiator radical. |