| abstract |
An integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) that includes a first substrate film (102) having a first side (102A), said first substrate film comprising a material substantially electrically insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded on said first side of the first substrate film so as to cover it at least partially, and a circuit assembly (104, 106, 204, 205) optionally comprising an electronic, electromechanical and / or electro-optical component disposed on the second side of the first substrate film, said circuitry being operatively connected to the first side of the first substrate film. |