| abstract |
The object of the present invention is to provide a semiconductor device in which the peeling between a molding resin and a substrate is attenuated. A semiconductor device 1 is molded by a molding resin layer 40 and comprises a semiconductor chip 20 and a substrate 10, the semiconductor device 1 being characterized in that it comprises, between the hardened molding resin 40 and the substrate 10, a resin layer 50 which is different from the molding resin layer 40 and having a thickness of at most 200 nm. It is preferred that the resin layer 50 between the molding resin layer 40 and the substrate 10 be at least 30% of the circumference of the chip, the total chip circumference being 100%. |