| abstract |
The resin film according to one aspect of the present invention is a resin film containing polyimide as a main component, and is a modified layer formed in the depth direction from at least one surface, and a non-modified layer other than the modified layer. And the open ring ratio of the imide ring of the polyimide of the modified layer is higher than the open ratio of the imide ring of the polyimide of the non-modified layer, and the average thickness of the modified layer from the one side Is 10 nm or more and 500 nm or less. |