http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019026578-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696b9c028c49e698817c64da9de426a1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 |
| filingDate | 2018-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f7e690f271f49b2a68a9177fb61e8cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf7cd984c8f9eff7f32c8ae118d923ff |
| publicationDate | 2019-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2019026578-A1 |
| titleOfInvention | POSITIVE ELECTRODE FOR ELECTROLYTIC COPPER PLATING AND COPPER ELECTROLYTIC VENEER USING THE POSITIVE ELECTRODE |
| abstract | The object of the present invention is to provide: a positive electrode for electrolytic plating of copper, to improve plating characteristics such as plating facilitation and viability fill properties, without increasing the complexity of the device structure; and an electrolytic copper plating apparatus using said positive electrode. To achieve this purpose, a positive electrode for electrolytic plating of copper, which is to be disposed in an electrolysis tank in which an electrolytic copper plating solution is stored, is characterized in that: said electrolytic plating solution of copper is an electrolytic copper plating solution containing a disulfide compound; and said positive electrode is arranged such that a positive electrode of soluble copper and an insoluble positive electrode are electrically connected. |
| priorityDate | 2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.