http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019021911-A1

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filingDate 2018-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_106159c2ab003556dce4363ab846420e
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publicationDate 2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2019021911-A1
titleOfInvention Support glass for semiconductor package
abstract According to one aspect of the present invention, there is provided a supporting glass for a semiconductor package, which is resistant to breakage or shattered when damaged. According to one aspect of the present invention, there is provided a supporting glass for a semiconductor package, which has a specific elastic modulus of 30 MNm / kg or more and an average thermal expansion coefficient α of 55 to 80 × 10 -7 / ° C at 50 ° C to 350 ° C. Be done. And / or a supporting glass having an X value of 30,000 or more as defined in the specification is provided.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023171558-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7296539-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021241312-A1
priorityDate 2017-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 43.