abstract |
According to one aspect of the present invention, there is provided a supporting glass for a semiconductor package, which is resistant to breakage or shattered when damaged. According to one aspect of the present invention, there is provided a supporting glass for a semiconductor package, which has a specific elastic modulus of 30 MNm / kg or more and an average thermal expansion coefficient α of 55 to 80 × 10 -7 / ° C at 50 ° C to 350 ° C. Be done. And / or a supporting glass having an X value of 30,000 or more as defined in the specification is provided. |