| abstract |
The invention relates to a thermosetting resin composition, a prepreg made therefrom, a laminate coated with a metal sheet, and a high frequency printed circuit board, the thermosetting resin composition containing thermosetting ingredients. The thermosetting ingredients comprise a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, the phosphorus-containing monomer or the phosphorus-containing resin has a structure as represented by Formula I. The present invention allows high-frequency dielectric properties and high-temperature resistance required by one circuit substrate to be provided by the use of a phosphorus-containing monomer or a phosphor-containing resin as the crosslinking agent of the other resin thermosetting composition containing an unsaturated group and by means of a crosslinking reaction of a large number of unsaturated double bonds in the resin. |