| abstract |
Provided is an active ester compound having a low elastic modulus under high temperature conditions in a cured product and excellent adhesion to copper foil, a curable composition containing the same, a cured product thereof, a semiconductor sealing material and a printed wiring board . Specifically, in the following structural formula (1) (wherein each R 1 is independently an aliphatic hydrocarbon group, an alkoxy group, a halogen atom, an aryl group or an aralkyl group. M is 0 or 1 to 4) And n is 0 or 1.) An active ester compound is provided which is a di-ester of a dihydroxy compound (a1) represented by the formula: and an aromatic monocarboxylic acid or an acid halide (a2) thereof. |