| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2e3830f35387a1c32061dea3ee310851 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 |
| filingDate |
2018-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f884c6bbea2677bfb98d12915395876
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4684b76532e91e2cb183ad965eca0c93 |
| publicationDate |
2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018236882-A1 |
| titleOfInvention |
COPPER ALLOYS FOR INTERCONNECTORS AND METHODS OF MAKING THE SAME |
| abstract |
The invention relates to interconnections of metal alloys (which may include copper) having low electrical resistivity and methods of making them. The electrical resistivity of thin-film copper alloys was reduced by 36% with niobium solids and 51% with iron solute compared with a pure copper counterpart in dilute solute regimes (from 0 to 1, 5% atomic). The manufacturing process is carried out at ambient temperature, and does not require a high temperature annealing step. |
| priorityDate |
2017-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |