http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018225773-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa6e4421d9e1159b6012d9bf702be572
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
filingDate 2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc01caff6ce29a3220c017df7f0087de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed57131b4dfe2ad2d3243e27db0bca2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83ac0401f2e46dfa87aace3b9746bdb6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50340b1e09ddcdfffda031bee5173583
publicationDate 2018-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018225773-A1
titleOfInvention Thermally-conductive and electrically-conductive adhesive composition
abstract The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is used as a die bonding material and which has adhesiveness at high temperatures and high thermal conductivity. The present invention pertains to a thermally-conductive and electrically-conductive adhesive composition which contains (A) an electrically-conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112080238-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112080238-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115521742-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115521742-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7215164-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020105412-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020105411-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022186285-A1
priorityDate 2017-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014040536-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007269959-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005113059-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID446284
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61718
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID413923119
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412798128
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8160
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419489300
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70259
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419697498
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11197
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID73864
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6853
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419544847
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID433322972
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557109
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415713687
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414862891
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415719497
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415715848
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID109115
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5312508
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415855197
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415808585
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6847
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425692565
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID370
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID154497087
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID752
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID445580
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID155063
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425534311
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31217
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID26113
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415745708
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID85959
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425065579
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456028012
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777488
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6544
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456986880
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407468301
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID103015
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13195
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522041
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16704
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28594
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14794892
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5280933
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426695109
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412833275
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8189
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415813506
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70012
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83658
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5281116
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5282826
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411626879
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17046
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419511196
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10467
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID335
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419547110
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415744893
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411029818
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12726607
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426068417
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16683
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409000855
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409588443
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408335764
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25795
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23954
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415730025
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415717720
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419521453
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474448
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID637517
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419584148
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID996
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID424968158
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID33600
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415780797
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID45087640
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15202944
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423288798
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420663812

Total number of triples: 125.