abstract |
The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is used as a die bonding material and which has adhesiveness at high temperatures and high thermal conductivity. The present invention pertains to a thermally-conductive and electrically-conductive adhesive composition which contains (A) an electrically-conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent. |