| abstract |
The present invention provides an epoxy resin composition which is easily B-staged and exhibits good curability in a short time, and which provides a resin cured product having high heat resistance. The present invention also provides a fiber-reinforced composite material which uses this epoxy resin composition and consequently has excellent bending strength. In addition, the present invention addresses the problem of providing a sheet molding compound which is composed of an epoxy resin composition that enables moderate and uniform progress of resin curing, and which provides a fiber-reinforced composite material that has good surface quality and excellent bending strength. An epoxy resin composition for fiber-reinforced composite materials, which contains the components (A)-(E) described below.n(A) an epoxy resinn(B) dicyandiamide or a derivative thereofn(C) a polyisocyanate compoundn(D) a urea compound represented by formula (1) (In the formula, each of R 1 and R 2 independently represents H, CH 3 , OCH 3 , OC 2 H 5 , NO 2 , a halogen atom or NH-CO-NR 3 R 4 ; and each of R 3 and R 4 independently represents a hydrocarbon group having 1-8 carbon atoms, an allyl group, an alkoxy group, an alkenyl group, an aralkyl group, or an alicyclic compound that contains R 3 and R 4 at the same time.)n(E) at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds and phosphine compounds |