| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5b05385d7060a590da808a339424d78 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E05Y2900-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E05Y2800-428
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08C2201-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G07C9-00944
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08C2201-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G07C2009-00968 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08C19-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E05F15-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08C17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G07C9-00857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G07C9-00182 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G12B9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate |
2018-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d81ccd3c42a7304a792ff2dfa958b2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2a7ae361b3ea6a3fd9bef03d45056c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e622c4ba47fd78d471573a7b2b8350
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e29b4443f6efc6f4c8d5de1e8c19f992
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82c879f4c6349a5c0b822ef2f3c521eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8692dd0715a6a2531de3187544da0067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_741b8fdaa286c69285025048e4d4f390 |
| publicationDate |
2018-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018212950-A1 |
| titleOfInvention |
Battery module housing and packaging |
| abstract |
A circuit assembly comprising a sealed interface is configured to isolate one of more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal. |
| priorityDate |
2017-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |