Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12715 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12708 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-185 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C18-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-18 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C18-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50 |
filingDate |
2018-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10d5e4dff91545f53df7a81d33226418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abf91c1c95c21bbc5b9997e081606fca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd5f89462e5b170a8d34ddbe041d72e2 |
publicationDate |
2018-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2018212174-A1 |
titleOfInvention |
Tin-plated copper terminal material, terminal, and power cable terminal structure |
abstract |
Provided is a tin-plated copper terminal material having: a substrate of copper or copper alloy; an intermediate zinc layer of zinc alloy that is formed on top of the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer of tin or tin alloy that is formed on top of the intermediate zinc layer and in which the proportion of the length occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed. Also provided are a terminal comprising said terminal material, and a power cable terminal structure using said terminal. |
priorityDate |
2017-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |