| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eec600c148cdf10f3a1736768f0522f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e35d119f7baeec632159502b6f791ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6e44c61e6b1b79f3428faa7bc99e296c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-254 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C27-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-0222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-4062 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-404 |
| filingDate |
2018-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15fea1f306a67a8406d29abb89f0f273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ed996631d5d598e880182be6597e37c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e95a21e10cc1e53108812e5f957242e1 |
| publicationDate |
2018-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018200920-A1 |
| titleOfInvention |
Glass electrochemical sensor with wafer level stacking and through glass via (tgv) interconnects |
| abstract |
A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate. |
| priorityDate |
2017-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |