| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_716ced455c5edbe3e93066825dc8d4ef |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2018-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc85376a5946245a4a1bdf1ae9c9551e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_beb7785c9972bce1411a7e73a4ee0d99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf2bed0c890b5bcc453774a7c67c3071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_097f0241c929a26babdee2d20689734e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_107d4e90620aff79ba3dcb0a2d6bd679
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3930f7c534b30091d5fb4986357dcb04 |
| publicationDate |
2018-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018187431-A1 |
| titleOfInvention |
Fully self-aligned via |
| abstract |
A first metallization layer comprising a set of first conductive lines that extend along a first direction on a first insulating layer on a substrate. A second insulating layer is on the first insulating layer. A second metallization layer comprises a set of second conductive lines on a third insulating layer and on the second insulating layer above the first metallization layer. The set of second conductive lines extend along a second direction that crosses the first direction at an angle. A via between the first metallization layer and the second metallization layer. The via is self-aligned along the second direction to one of the first conductive lines. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3534395-A1 |
| priorityDate |
2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |