| abstract |
Provided is a resin composition capable of: giving a prepreg which has satisfactory formability and high adhesiveness to the base and is reduced in dusting; and forming a cured object having a low coefficient of thermal expansion. The resin composition comprises an epoxy resin, dicyandiamide, a phenoxy resin, a core-shell rubber, and an inorganic filler. The phenoxy resin has a weight-average molecular weight of 30,000 or higher. The phenoxy resin has a tensile elongation of 20% or higher. The content of the phenoxy resin is 5-30 parts by mass per 100 parts by mass of the epoxy resin. The content of the core-shell rubber is 3-20 parts by mass per 100 parts by mass of the epoxy resin. |