| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 |
| filingDate |
2018-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f4c77e9ea7db7cb071eba0acae17ff1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc5f8f336f2e87b7f909fcdf0e19a8ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed1d5167756c4fd9b79252df5c28b44a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ae0655216f9134b528f431ff9f8863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc8d43d447bf8e0c90589378f2ecbed0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dd9561e4044a87a1dbda5435d952b9e |
| publicationDate |
2018-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018181803-A1 |
| titleOfInvention |
Curable resin composition, dry film, cured product and electronic component |
| abstract |
Provided are: a curable resin composition which enables the achievement of a cured product that is able to maintain low thermal expansion coefficient not only at normal temperature but also in a high temperature range exceeding 200°C during component mounting, while having low dielectric characteristics without deteriorating the other characteristics; a dry film which uses this curable resin composition; a cured product; and an electronic component. The present invention provides a curable resin composition which contains: a fine powder that is smaller than 100 nm at least in one dimension; and an active ester compound. The present invention also provides: a dry film which uses this curable resin composition; a cured product; and an electronic component. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110819089-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7321781-B2 |
| priorityDate |
2017-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |