| abstract |
The present invention provides: a curable resin composition with which it is possible to obtain a cured product that is capable of retaining a low thermal expansion rate even in a high-temperature range during component mounting and that exhibits various excellent properties such as toughness; and a dry film, a cured product, and an electronic component using the curable resin composition. The curable resin composition comprises a curable resin, a fine powder in which at least one of the dimensions is smaller than 100 nm, and a filler other than the fine powder. The dry film, the cured product and the electronic component are obtained by using said curable resin composition. |