| abstract |
Provided are: a prepreg for a coreless substrate, which is able to satisfy heat resistance, low thermal expansion and bonding strength to a metal circuit at high levels required for coreless substrates; and a coreless substrate and a semiconductor package, each of which uses this prepreg for a coreless substrate. Specifically, this prepreg for a coreless substrate contains a thermosetting resin composition that contains (a) dicyandiamide, (b) an addition product of a tertiary phosphine and a quinone, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two N-substituted maleimide groups. In place of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound having at least two N-substituted maleimide groups, an amino-modified polyimide resin (X), which is obtained by reacting the amine compound and the maleimide compound with each other, may be used. |