| abstract |
The purpose of the present invention is to achieve: a negative photosensitive resin composition which has high sensitivity and is capable of forming a pattern having a low tapered shape after development and thermal curing, while being able to suppress dimensional change of a pattern opening width before and after the thermal curing, and which is capable of forming a cured film having excellent light blocking properties; and a cured film which has excellent light blocking properties. A negative photosensitive resin composition which contains (A) an alkali-soluble resin, (B) a radically polymerizable compound, (C1) a photopolymerization initiator and (Da) a blackening agent, and which is configured such that: the alkali-soluble resin (A) contains (A1) a first resin which contains one or more substances selected from the group consisting of (A1-1) polyimides, (A1-2) polyimide precursors, (A1-3) polybenzoxazoles, (A1-4) polybenzoxazole precursors and (A1-5) polysiloxanes; and the radically polymerizable compound (B) contains one or more compounds selected from the group consisting of (B1) radically polymerizable compounds containing a fluorene skeleton and (B2) radically polymerizable compounds containing an indane skeleton. |