| abstract |
Provided is a resin composition which can be used to form a cured resin product, a resin substrate, and a laminate substrate having excellent heat dissipation properties and tracking resistance, and has excellent filling properties. This resin composition contains a main agent containing an epoxy compound, a curing agent, and inorganic particles, wherein the curing agent contains an aromatic compound in which the ratio of the number of carbon atoms constituting the aromatic ring thereof with respect to the number of all carbon atoms in the molecule thereof is 85% or more, the contained amount of the inorganic particles is 40-75 vol% with reference to the total amount of all components of the composition other than a solvent, the inorganic particles include boron nitride particles and particles different from boron nitride particles, and the contained amount of the boron nitride particles is 3-35 vol% with reference to the total amount of all components of the composition other than a solvent. |