http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018173499-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-6824 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate | 2018-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c52d5bf537499184d6674663714d596 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61648a0ca654566c44c8dc9a880f3a36 |
| publicationDate | 2018-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2018173499-A1 |
| titleOfInvention | Polyester resin and cured product thereof |
| abstract | Provided are: a polyester resin having exceptional heat resistance, dielectric properties, and substrate adhesion in a cured product; a curable resin composition containing the polyester resin; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. A polyester resin having a phenolic hydroxyl-group-containing resin (A) and a carboxylic acid compound or an acid halide (B) thereof as essential reaction raw materials, in which the phenolic hydroxyl-group-containing resin (A) is a phenolic hydroxyl group-containing resin (A-1) having a phenolic hydroxyl-group-containing compound (a1) and an aromatic aldehyde compound (a2) as essential reaction raw materials, or a phenolic hydroxyl-group-containing resin (A-2) having a phenolic hydroxyl-group-containing compound (a1) and an aromatic ring-containing divinyl compound (a3) as essential reaction raw materials; a curable resin composition containing the polyester resin; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. |
| priorityDate | 2017-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 113.