| abstract |
The present invention addresses the problem of providing a photosensitive siloxane resin composition which is able to be cured at low temperatures and has excellent storage stability and resolution, while being capable of suppressing development residue, and which enables the achievement of a cured film that exhibits high hardness, while having excellent chemical resistance and excellent adhesion to a substrate. The present invention is a photosensitive siloxane resin composition which contains (A) a polysiloxane, (B) a radical photopolymerization initiator, (C) a polyfunctional monomer and (D) an amine salt of a phosphoric acid derivative. |