| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cbffa3b81b3b862dc7220b5648f5f745 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2021-60277 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-6833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02606
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-25 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-04 |
| filingDate |
2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27142bcd545f4648f8d4157f71c25454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7357107604724d3b181dc3cfa3ef6b50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1fa57c14e0a5084eef32f261d39681b |
| publicationDate |
2018-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018151448-A1 |
| titleOfInvention |
Dry-type biomimetic adhesion patch having high elasticity and conductivity, method for manufacturing same, and wearable device comprising same |
| abstract |
In a method for manufacturing a dry-type biomimetic adhesion patch having high elasticity and conductivity, a semiconductor substrate including an insulation layer is etched using a footing effect to prepare a mold including a plurality of holes. A mixed conductive filler including a one-dimensional conductive filler and a two-dimensional conductive filler mixed therein is dispersed in a liquid elastomer to prepare a conductive polymer composite. The conductive polymer composite is applied on the mold so as to be injected into the plurality of holes. The conductive polymer composite applied on the mold is post-treated and the mold is then removed, so that a dry-type conductive adhesion structure including a plurality of micropillar structures corresponding to the plurality of holes is obtained. Each of the micropillar structures includes a body portion, and a spatula-shaped tip portion formed on the body portion to have, on a plane, a larger area than the body portion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022167854-A1 |
| priorityDate |
2017-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |