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filingDate 2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018147228-A1
titleOfInvention Electromagnetic wave-suppressing heat transfer sheet, method for producing electromagnetic wave-suppressing heat transfer sheet, and semiconductor device
abstract Provided is an electromagnetic wave-suppressing heat transfer sheet which exhibits high adhesion to a heat source or a heat dissipation member, while having excellent heat conductivity and electromagnetic wave suppression effect. In order to solve the above-described problem, an electromagnetic wave-suppressing heat transfer sheet 1 according to the present invention contains a binder resin 11 and a fibrous heat conductive filler 12, and is characterized in that this electromagnetic wave-suppressing heat transfer sheet 1 is obtained by connecting a vertically aligned body 10a, in which the heat conductive filler 12 is aligned in a direction T that is generally perpendicular to a sheet surface S, and a horizontally aligned body 10b, in which the heat conductive filler 12 is aligned in a direction that is generally parallel to the sheet surface S, with each other within the same plane.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021230320-A1
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priorityDate 2017-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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