Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
filingDate |
2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fb2b0dd60adbf0261465cbb0ea3870a |
publicationDate |
2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2018147228-A1 |
titleOfInvention |
Electromagnetic wave-suppressing heat transfer sheet, method for producing electromagnetic wave-suppressing heat transfer sheet, and semiconductor device |
abstract |
Provided is an electromagnetic wave-suppressing heat transfer sheet which exhibits high adhesion to a heat source or a heat dissipation member, while having excellent heat conductivity and electromagnetic wave suppression effect. In order to solve the above-described problem, an electromagnetic wave-suppressing heat transfer sheet 1 according to the present invention contains a binder resin 11 and a fibrous heat conductive filler 12, and is characterized in that this electromagnetic wave-suppressing heat transfer sheet 1 is obtained by connecting a vertically aligned body 10a, in which the heat conductive filler 12 is aligned in a direction T that is generally perpendicular to a sheet surface S, and a horizontally aligned body 10b, in which the heat conductive filler 12 is aligned in a direction that is generally parallel to the sheet surface S, with each other within the same plane. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021230320-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020202939-A1 |
priorityDate |
2017-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |